PCB Manufacturing Capabilities
Intratek has a proven track record of the highest quality, on-time delivery, and competitive pricing.
We Can Facilitate Any Process of Your Custom Circuit Boards
Design & Engineering
Design & Assembly, DFM Consultation, Reverse Engineering, Scanning, DRC. (Design Rule Check)
Material Types
FR4, FR406, FR408, IS 410, Teflon, Polyimide, Flex and Rigid flex, Ceramic Boards, Getek, CEM1 AND CEM3
Electrical Tests
Min. SMD Pitch 0.20, Flying Probe Testing, Clam Shell Testing, 100% Netlist Testing
Process Capabilities
Max. Production Panel: 20X24, Max. Layers: 30, Min. Line width/space: +/-.003, Min. Hole Size: 0.010, Hole Size Tolerance: +/-.003, Max. Finish Copper: 4 oz., Min. Angular Ring 0.004, Layer to Layer Accuracy 0.005
Surface Finishes
SMOBC, Hot Air Solder Level, No Lead Solder,Electroless Silver, Electroless White Tin, Electroless Nickel/Gold, Carbon Ink Pads
Additional
Blind & Buried Vias, Ball Grid Array (BGA), Plated Slots and Edges,Beveling, Scoring
Fast Prototyping. 2 Layer – 24 Hour Turn Around!
We can quickly create a suitable prototype based on your specifications.